• High Speed Interface Design Solution
 

 

  • Successfully deployed in 20+ customer projects
  • IP total solution with MAC/PCS/PMA
  • SoC test mode integration
  • Test pattern generation &  At speed production test

  • Production Proven Package Design Service Solutions

  • Experience in domain IP design, sourcing & qualification
  • Signal integrity & noise immunity prevention
  • Chip + package electrical design & test solutions
  • 3D Substrate Parasitic Extraction

  • Accurate 3D package substrate parasitlc extraction
  • Electrical timing and frequency response simulation
  • Thermal effect of package and material selection
  • Predictable solution for turnkey and ASIC design
 
  • 3D Extraction & Simulation Example
  • Production Test Solutions

  • Experienced engineering team and in-house equipment for fast test program development
  • In-house test equipment of Verigy A93000 and Teradyne J750
  • Robust supply chain via solid test vendor collaboration

 

 

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