• Package Service
 
This is to provide Package design, development services as details listed below, Key features of our Packaging Service are as follows
  • Chip/Package/Board co-design and co-simulation
  • Package level electrical/thermal/mechanical simulation
  • System-in-Package 

 

 
  • GUC Package Production Milestone
 
  • Chip-Package-Board Co-design/Co-simulation

 

  • Chip/Package/Board co-design & co-simulation are essential and critical to high speed products for   
    - Improving performance by optimizing floor plan, layout, pad location, I/O and electrical timing budgeting among chip/package/board        
     - Reducing cost by identifying optimized package configuration & size, substrate/board size & layers
 
 
  • Co-simulation includes signal integrity, power integrity and thermal
 

 

 

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