Test Service

The service includes product wafer level circuit probing (CP) and package level final test (FT) program development, testing hardware design and manufacturing and production test management. GUC’s in-house advanced technology IP development portfolio allows us to develop test solution in advance to support products with high-speed interface from SerDes, PCIe, SATA, XAUI, LVDS to DDRn, etc. These complete proven test solutions enable the program development first cut work with short cycle time and faster time-to-market.


High-speed Interface Test Solutions

Complete loadboard design, layout, simulation and verification methodology to ensure product test specification can be met with high test coverage.



High-speed Interface Test Solutions 





DDR On-board Test


High-power Test Solutions  

Comprehensively test hardware design and test methodology to ensure power integrity can meet product test specification.

ApplicationPower ConsumptionPackage (mmxmm)Pin Count
Networking >80W HFCBGA 55x55  2912
Networking >100W HFCBGA 50x50  2401