GUC multi-die interLink (GLink) IP |
GUC multi-die interLink (GLink) IP provides world's best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a package for applications such as High Performance Computing, Data Center, Artificial Intelligence and Networking.
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GUC multi-die interLink (GLink) IP
Part. No | Process | Description | Readiness | Download |
---|---|---|---|---|
IGAD2DY01A | 5nm | Die to Die Interface PHY | 2020Q4 | - |
IGAD2DX01A | 6nm/ 7nm | Die to Die Interface PHY | V |