GUC Die-to-Die (GLink) IP

GUC multi-die interLink (GLink) IP

GUC multi-die interLink (GLink) IP provides world's best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a package for applications such as High Performance Computing, Data Center, Artificial Intelligence and Networking.

The IP utilizes single-ended DDR clock forwarding parallel bus interface with TSMC's RDL-based InFO (Integrated-Fan-Out) or CoWoS (Chip-on-Wafer-on-Substrate) up to 8/16Gbps per lane which consumes only 0.26pJ/bit. One slice has 32 full-duplex lanes and one PHY has 8 slices with 2/4Tbps maximum bandwidth.