Press Release
Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration
Congratulations on the GUC's paper acceptance by IEEE and our member's invitation to present at the 74th ECTC on May 31st, 2024.
We (GUC) will present our high speed integrated design (signal integrity) solution for HBM3E-9.2Gbps on organic interposer technology. The paper will also be filled at IEEE Xplorer Digital Library (https://ieeexplore.ieee.org/Xplore/home.jsp). (The link will be updated after posting on IEEE)
Paper Title: Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration
Content
Introduction
HBM3 SI Design Flow and Optimization
The proposed GSG-interleaved T-lines at CoWoS-R
HBM3 High Speed Interconnection Design
Design-of-Experiments at Interconnect Routing Rules
Interconnect Post-Layout Simulation
Insertion loss / Crosstalk Characterization
FoMsof High Speed Interconnect Design
Eye-diagram Co-Simulation
Measurement and Correlation
Conclusion
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