Date Title
2021/10/05 GUC Monthly Sales Report in Sep
2021/09/06 GUC Monthly Sales Report in Aug
2021/08/31 GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2.0) Total Solution
2021/08/05 GUC Monthly Sales Report in July
2021/07/05 GUC Monthly Sales Report in June
2021/06/24 GUC and Omni Design Tape Out 16nm LiDAR SoC
2021/06/08 GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS® Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
2021/06/07 GUC Monthly Sales Report in May
2021/05/24 GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric™ Advanced Packaging Technology
2021/05/05 GUC Monthly Sales Report in Apr
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