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2021/10/05 |
GUC Monthly Sales Report in Sep
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2021/09/06 |
GUC Monthly Sales Report in Aug
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2021/08/31 |
GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2.0) Total Solution
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2021/08/05 |
GUC Monthly Sales Report in July
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2021/07/05 |
GUC Monthly Sales Report in June
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2021/06/24 |
GUC and Omni Design Tape Out 16nm LiDAR SoC
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2021/06/08 |
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS® Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
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2021/06/07 |
GUC Monthly Sales Report in May
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2021/05/24 |
GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric™ Advanced Packaging Technology
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2021/05/05 |
GUC Monthly Sales Report in Apr
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