Chip design (spec-in) and implementation solutions are developed to tackle the challenges of billion-gate, GHz-frequency, SoC/subsystem design, DFT, IR drop, ESD, DFM, and time to market.LEARN MORE
Working closely with foundries and world-class supply chain partners, GUC offers industry-leading manufacturing services and advanced packaging technologies that cover everything from design to finished goods.LEARN MORE
GUC’s key IP solutions (GLink/HBM), along with its 2.5D/3D advanced packaging technology and 5G AFE IP, are tailored to customers’ ASIC needs for AI/HPC/5G networking applications.LEARN MORE
GUC Monthly Sales Report in May
Hsinchu, Taiwan, June 5, 2023 - GUC (TAIEX: 3443) today announced its net sales for May 2023 were NT2,149 million, increased 6.7% month-over-month and also increased 24.6% year-over-year. Net sales for five months in 2023 totaled NT$10,692 million, increased 33.4% compared to the same period in 2022. GUC Sales Report
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform 26 Apr 2023 - SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the most advanced cloud data centers. GUC’s big-die CoWoS platform represents real-world CPU, GPU, AI, and networking chips by integrating multiple instances of the Cadence 112G-LR SerDes with a 7.2Gbps HBM3 controller and PHY, as well as a GLink-2.5D die-to-die IP in the TSMC N7 process. Cadence collaborated with GUC on the interposer design to meet the strict high-speed signal integrity (SI) and power integrity (PI) requirements of 112G-LR SerDes signaling through silicon (CoWoS-S) and organic (CoWoS-R) interposers. The 112G-LR SerDes has been validated in the GUC CoWoS platform, demonstrating excellent performance and robustness in large-scale AI/HPC/networking chip conditions. “Our AI/HPC/networking platform on TSMC’s CoWoS® technology meets high-power and high-speed requirements at the system level and demonstrates our industry leadership in delivering complete advanced packaging solutions,” said Igor Elkanovich, CTO at GUC. “Cadence’s robust, production-quality 112G SerDes was instrumental in allowing us to unleash new potential for scalable, multi-die AI, HPC and networking solutions.” “The successful demonstration of the Cadence 112G-LR SerDes in GUC’s platform using TSMC’s CoWoS technology is a great example of design ecosystem collaboration on 2.5D multi-die packaging solutions,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “Cadence’s leading IP solutions together with TSMC’s advanced technologies enable system-level innovations for AI/ML, HPC and networking applications.” “Our successful collaboration with GUC exemplifies how Cadence is delivering SoC design excellence through our Intelligent System Design strategy,” said Sanjive Agarwala, corporate vice president and general manager of the IP Group at Cadence. “The Cadence 112G-LR/ELR PAM4 SerDes IP portfolio has been widely adopted by customers to enable AI, HPC, networking and 5G SoC designs. This milestone expands our collaboration, enabling GUC to prove their groundbreaking CoWoS platform and solidifying Cadence’s leadership in high-performance connectivity IP offerings.” The Cadence 112G-LR SerDes incorporates industry-leading analog-to-digital converter (ADC) and digital signal processor (DSP) technology that delivers exceptional long-reach performance with superior margin and optimized power and area. The IP provides multi-rate support including 112/56Gbps in PAM4 mode, as well as 56Gbps and lower data rates in NRZ mode. The IP supports both standard and advanced packaging technologies. The 112G-LR SerDes IP is part of the broader Cadence IP portfolio and supports the company’s Intelligent System Design Strategy, enabling SoC design excellence. For more information, please visit www.cadence.com/go/112gpr. About Cadence Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design™ strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at www.cadence.com. © 2023 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners . About GUC GLOBAL UNICHIP CORP. (GUC) is the Advanced ASIC Leader who provides the semiconductor industry with leading IC implementation and SoC manufacturing services, using advanced process and packaging technology. Based in Hsin-Chu, Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. *This is a joint press release published by Cadence.
GUC Monthly Sales Report in April
Hsinchu, Taiwan, May 5, 2023 - GUC (TAIEX: 3443) today announced its net sales for Apr 2023 were NT2,014 million, decreased 8.1% month-over-month but increased 13.4% year-over-year. Net sales for four months in 2023 totaled NT$8,543 million, increased 35.8% compared to the same period in 2022. GUC Sales Report
GUC Tapeouted 3DIC Testchip by WoW Technology
Beyond Moore’s law era, Chiplet is the economical method to build large systems out of smaller functions. There are several advanced packaging technologies for chiplets integration, such as CoWoS, InFO_oS, SoIC, …, etc. After the experience of DTC stacked-on-logic die by WoW technology, GUC successfully taped out another 3DIC logic-on-logic test chip by WoW technology again. The Benefits of 3DIC Reduce RC loading, power consumption and latency Increase bandwidth Heterogeneous die integration for PPA optimization For more information, please contact your GUC sales representative directly or email firstname.lastname@example.org
GUC TCAM Value Proposition
High performance, small area TCAM compiler solution from N16 to N4P 15% faster cycle time and 6% smaller area Different Vt flavors for speed and power trade-off Word bank and bit bank options for optimal area and speed target 1st cut success in N7 and N12 TK customer chips, go for MP smoothly
GUC Will Be Exhibiting at TSMC 2023 Technology Symposium
Join us in person at the TSMC 2023 Technology Symposium. Come to visit us at our booth. Wednesday, April 26 – North America Technology Symposium Wednesday, May 3 – Austin Technology Workshop Tuesday, May 9 – Boston Technology Workshop Thursday, May 11 – Taiwan Technology Symposium Tuesday, May 23 – Europe Technology Symposium Tuesday, June 6 – Israel Technology Workshop Wednesday, June 21 – China Technology Symposium Friday, June 30 – Japan Technology Symposium https://www.tsmc.com/static/english/campaign/Symposium2023/index.htm 【GUC NA Booth Highlights】 Live Demo at TSMC NA Symposium [GUC booth #416] On-site R&D Experts to Answer Your Questions First-hand Technology Resources Updates: Advanced Packaging Technology Platform, AI & HPC, Networking Turnkey Total Solution, and more
GUC Core Strengths
At GUC, customer-oriented values are essential to everything we do. We will uphold GUC’s core strengths and commit ourselves to our customers’ success.
Unleashing the Future of Innovation with GUC APT
With in-house IPs and unrivalled experience in 2.5D/3D advanced packaging technology, GUC offers the total service package to meet your various design needs, from IP (HBM, GLink-2.5D, and GLink-3D) to package design (CoWoS, InFO, and SoIC).