Solutions
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ASIC Service
Chip design (spec-in) and implementation solutions are developed to tackle the challenges of billion-gate, GHz-frequency, SoC/subsystem design, DFT, IR drop, ESD, DFM, and time to market.
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Production Service
Working closely with foundries and world-class supply chain partners, GUC offers industry-leading manufacturing services and advanced packaging technologies that cover everything from design to finished goods.
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IP Portfolio
GUC’s key IP solutions (GLink/HBM), along with its 2.5D/3D advanced packaging technology and 5G AFE IP, are tailored to customers’ ASIC needs for AI/HPC/5G networking applications.
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GUC News
GUC Core Strengths
At GUC, customer-oriented values are essential to everything we do. We will uphold GUC’s core strengths and commit ourselves to our customers’ success.
Unleashing the Future of Innovation with GUC APT
With in-house IPs and unrivalled experience in 2.5D/3D advanced packaging technology, GUC offers the total service package to meet your various design needs, from IP (HBM, GLink-2.5D, and GLink-3D) to package design (CoWoS, InFO, and SoIC).