Hsinchu, Taiwan – Oct. 16th, 2025 – Global Unichip Corp. (GUC), the Advanced ASIC leader, today announced it has joined the NVIDIA NVLink Fusion as a key ASIC ecosystem partner, strengthening its role in enabling next-generation AI ASICs. GUC will also participate in the 2025 Open Compute Project (OCP) Global Summit as a panel speaker on "Delivering on Co-Packaged Optics."
Accelerating the AI ASICs with NVLink Fusion
NVIDIA's NVLink Fusion architecture allows companies to integrate semi-custom ASICs seamlessly into optimized, widely deployed data center systems. As part of this open ecosystem, GUC collaborates with NVIDIA and ecosystem partners to help scale the AI ASICs that power advanced model training and inference.
Leveraging deep expertise in high-speed interconnect, chiplet integration, and advanced packaging, GUC delivers ASIC and chiplet solutions that enhance bandwidth, efficiency, and scalability in datacenter architectures.
"ASIC innovation is critical as AI workloads continue to grow," said Aditya Raina, CMO of GUC. "Through its ecosystem, GUC is accelerating the adoption of NVLink Fusion and facilitating customers with its high-performance silicon solutions driving the next generation of AI ASICs."
Advancing Co-Packaged Optics
At the 2025 OCP Global Summit, GUC will join industry leaders in discussing Co-Packaged Optics (CPO) — a key technology to reduce power and increase bandwidth in future AI and HPC systems. GUC's integration capabilities across ASIC design and 2.5D/3D packaging make it a critical enabler for this transition.
- Learn more about NVIDIA NVLink Ecosystem
- Learn more about GUC and the Open Compute Project at the OCP Global Summit, taking place at the San Jose Convention Center from Oct. 13-16.
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