创意聚焦

This presentation will focus on the benefits of performance and in-mission health monitoring of 1000s of die-to-die I/Os based on Universal Chip Telemetry (UCT), which consists of monitoring IPs embedded inside the PHY, and a deep data analytics platform. The paper is based on collaborative work with Global Unichip (GUC) on the novel HBM2E and GLink PHY IPs, and the results were demonstrated through multiple test chips.

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