GUC presents the Leading APT Solutions at ICCAD 2021 (Wuxi, China)
Using GUC Leading APT Solutions (Advanced Package Technology) for 2.5D&3D Multi-die integration, making the revolution in CPU, GPU, HPC, AI and Networking Processors
- 3D stacked dies (TSMC-SoIC™) on top of 2.5D (CoWoS®/InFO)
- GUC GLink is the most efficient IP for CoWoS®/InFO_oS
- HBM/CoWoS® full solution at N16/N12/N7/N6/N5
- Hundreds lanes of 112 Gbps SerDes package experience
ICCAD 2021 Forum on Dec. 23: https://www.cicmag.com/bbx/532285-532285.html
GUC 核心优势
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service