GUC Presents the 2D/2.5D/3D Chiplets and Interface Standardization at 2022 WSCE (Nanjing, China)
GUC will be presenting at the 2022 World Semiconductor Conference & Nanjing International Semiconductor Expo. Come to visit us at our booth and to listen to our speech session.
- Speech Title: 2D/2.5D/3D Chiplets and Interface Standardization
- Highlight:
- Chiplets-based architectures
- 2.5D die to die interfaces
- 3DIC technology
- 2022 WSCE Aug/18~Aug/20 Meeting Agenda: http://www.wsc-expo.com/activity.html
GUC 核心优势
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service