GUC Announces to Join UCIe as Contributor Member

  • GUC joins the Universal Chiplet Interconnect Express (UCIe) as Contributor Member and is the member of 6 working groups to contribute our expertise to the next-generation of UCIe technology
  • GUC has been providing GLink (GUC multi-die interLink) family, the most optimized die to die connection solution for TSMC CoWoS and InFO, been adopted by AI/HPC/DC customers
  • GLink already supports most of UCIe 1.0 digital and analog functionality
  • GLink to support UCIe: minor, low risk changes:
    • UCIe bump map, Link Training, Sideband Channel (digital), FDI Interface, in-band CRC
  • First N5 GUC UCIe to be taped out in 1H23

Learn more about GLink: https://www.guc-asic.com/en/solution-ip-d2d.php   
 

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