GUC is Exhibiting at the TSMC 2022 Open Innovation Platform Ecosystem Forum

Starting from this month, TSMC 2022 OIP Ecosystem Forum kicks off at Santa Clara Convention Center, CA. And GUC will be there, to show our latest innovations. In addition, our CTO, Igor Elkanovich will present GUC’s 2.5D and 3D Chiplets, Interconnect Solutions and Trends in the HPC and 3DIC Track.

 

Meet GUC experts and stop by our booth on October 26th. 

  • Live Demo at TSMC NA OIP [GUC booth #608]
    • Silicon Proven at TSMC N7 and CoWoS Technology HBM3 Demo
    • World-class Die-to-Die Solution GLink Demo
  • On-site R&D Experts to Answer Your Questions
  • First-hand Technology Resources Updates: GUC 3nm Design Platform, Advanced Packaging Technology Platform, AI & HPC, Networking Turnkey Total Solution, and more

Join us to explore and connect! https://pr.tsmc.com/english/events/tsmc-events 

 

Upcoming OIP Events:

  • 2022/11/08 Netherlands
  • 2022/12/06 China