White Paper: GUC GLink™ Test Chip Uses In-Chip Monitoring and Deep Data Analytics for High Bandwidth Die-to-Die Characterization
This white paper is produced by proteanTecs, a leading provider of deep data monitoring solutions for advanced electronics in the Datacenter, Automotive, Communications and Mobile markets.
The GUC and proteanTecs collaboration started with GUC’s second generation of GLink (GLink 2.0). The project target was to implement the proteanTecs monitoring system into the 5nm test chip to assist GUC in testing and characterizing the GLink PHY. proteanTecs is the only company offering comprehensive visibility into high bandwidth die-to-die interfaces based on unique, patent-protected technology.
Check out this GUC’s GLink case study: Performance and reliability monitoring for heterogeneous packaging, combining deep data with machine learning algorithms. This white paper is produced by proteanTecs. Download the complete file from proteanTecs official website: https://www.proteantecs.com/resources/guc-glink-tm-test-chip-uses-in-chip-monitoring-and-deep-data-analytics-for-high-bandwidth-die-to-die-characterization
GUC 核心优势
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service