GUC CoWoS-R Solution for Better Cost Effectiveness and SI Performance
Based on tsmc 3DFabric technology, GUC now start to offer CoWoS-R advanced package technology for HPC/AI applications. Compared with CoWoS-S, CoWoS-R adopts RDL interposer to replace silicon interposer. It will provide better cost effectiveness and SI performance. The HBM3-7.2Gbps eye diagram is as below.
Technology Readiness
- TSMC
- Customer product with 1.4X reticle(1SoC+2HBM2) start ramping from 2H’22
- Test vehicle with 3.3X reticle(4SoC+8HBM3) will be qualified in 1Q23
- GUC
- Design flow ready and proven. Successfully taped out N5 test chip (2SoC+1HBM2E) and N7 test chip (1Soc+2HBM3)
- Service Start from Following Configurations
GUC 核心优势
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service