GUC N5 HBM3 IP Silicon Proven

Highlights

  • IP: HBM3 8.4Gbps PHY and Controller
  • Process: TSMC N5
  • 2.5D Package: CoWoS-S
  • Status: Design Kit ready
  • Adopted by leading customers AI/HPC application ASIC

Test Summary

  • 5 corners: TT/SS/FF/SF/FS
  • Samsung HBM3 DRAM
  • Read/Write operation pass @8.4Gbps
  • Training, Loopback, and BIST pass @ 8.4Gbps
  • Eye opening > 50%

GUC 核心优势

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service