Integrated Design for SI/PI/Thermal/Mechanical Analysis and Tape-out Sign-off
There are more and more chips required advanced packaging technology but have following challenges:
- High speed data transmission (>16Gbps) & low supply voltage (<0.5V)
- Tough SSN/SSO requirement (<40mVpp) & IR-drop (Vmin<5% from Vnom)
- Huge power consumption (>1kW) & multiple chiplets integration (1SoC+4HBM)
GUC can offer SI/PI/Thermal/Mechanical integrated design service to overcome such challenges and to ensure 1st Silicon Success. The figure below shows the flow of SI/PI/Thermal/Mechanical design service.
For more information, please contact your GUC sales representative directly or email guc_sales@guc-asic.com
GUC 核心优势
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service