Integrated Design for SI/PI/Thermal/Mechanical Analysis and Tape-out Sign-off

There are more and more chips required advanced packaging technology but have following challenges: 

  • High speed data transmission (>16Gbps) & low supply voltage (<0.5V)
  • Tough SSN/SSO requirement (<40mVpp) & IR-drop (Vmin<5% from Vnom)
  • Huge power consumption (>1kW) & multiple chiplets integration (1SoC+4HBM)  

GUC can offer SI/PI/Thermal/Mechanical integrated design service to overcome such challenges and to ensure 1st Silicon Success. The figure below shows the flow of SI/PI/Thermal/Mechanical design service.

 
For more information, please contact your GUC sales representative directly or email guc_sales@guc-asic.com 

GUC 核心優勢

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service