GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform
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GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform
About GUC
"GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC (application-specific integrated circuit) services. Our comprehensive design services include ‘spec-in’ and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies (APT), turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory), die-to-die and die-on-die interconnect IPs.
GUC leads the ASIC service market in the AI (artificial intelligence), HPC (high-performance computing), Automotive, 5G/networking, SSD (solid-state drive), and several other industrial segments. We are committed to expertly delivering to customers the most competitive PPA (power, performance, and area) designs, promising quality and yield. We dedicate ourselves to differentiating our services in the highly competitive market through engineering excellence. Based in Hsinchu, Taiwan, GUC has a global reputation with presence in North America, Mainland China, Europe, Korea, Japan and Vietnam. GUC is traded on the Taiwan Stock Exchange (TWSE: 3443)."
*This is a joint press release published by Cadence.