GUC HBM3 Platform is Silicon Proven at TSMC N7 and CoWoS Technology

  • Live demo at TSMC NA Symposium [GUC booth #316]
  • Highlights
    • Full functional HBM3 Controller and PHY at 7.2Gbps
    • GLink-2.5D interface to connect multiple chips over CoWoS
    • Good 112G SerDes performance on CoWoS
    • GUC’s proprietary interposer design to support any angle zig-zag routing
    • Support both Samsung and SK hynix HBM3
    • Support both TSMC CoWoS-S and CoWoS-R advanced package

GUC 核心优势

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service