GUC HBM3 Platform is Silicon Proven at TSMC N7 and CoWoS Technology
- Live demo at TSMC NA Symposium [GUC booth #316]
- Highlights
- Full functional HBM3 Controller and PHY at 7.2Gbps
- GLink-2.5D interface to connect multiple chips over CoWoS
- Good 112G SerDes performance on CoWoS
- GUC’s proprietary interposer design to support any angle zig-zag routing
- Support both Samsung and SK hynix HBM3
- Support both TSMC CoWoS-S and CoWoS-R advanced package
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service