GUC to Participate in Upcoming ICCAD 2022
GUC is exhibiting at the ICCAD 2022 event. We will discuss GUC's 2.5D and 3D Chiplets, Interconnect Solutions and Trends at the Xiamen International Conference & Exhibition Center. The event will be held from Dec. 26 to 27, 2022. Come to visit us at our booth and to listen to our speech session.
- GUC Booth No. 096-097
- GUC Speech
- Date: Dec. 27, Tuesday, 2022
- Time: 13:30-13:50
- Track: Subject Forum (I)
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Speech Agenda
- Chiplets-based CPUs
- GLink-2.5D die to die interface
- HBM3 and CoWoS
- 3DIC interface
