GUC Announces to Join UCIe as Contributor Member
- GUC joins the Universal Chiplet Interconnect Express (UCIe) as Contributor Member and is the member of 6 working groups to contribute our expertise to the next-generation of UCIe technology.
- GUC has been providing GLink (GUC multi-die interLink) family, the most optimized die to die connection solution for TSMC CoWoS and InFO, been adopted by AI/HPC/DC customers
- GLink already supports most of UCIe 1.0 digital and analog functionality
- GLink to support UCIe: minor, low risk changes:
- UCIe bump map, Link Training, Sideband Channel (digital), FDI Interface, in-band CRC
- First N5 GUC UCIe to be taped out in 1H23
Learn more about GLink: https://www.guc-asic.com/en/solution-ip-d2d.php
