GUC's SI/PI/Thermal Simulation Capability Enabled the Mass Production of Flagship Network Chip Using High-Speed 112G SerDes
The integration challenge of 112G LR SerDes is significantly high.
GUC's SI/PI/THM simulation capability successfully help customer's complex high-lane-count 112G SerDes product into mass production.
With state-of-the-art simulation workflow, GUC expedited the design qualification and time to market with signal / power / thermal integrity.
Key achievements for this product:
- Ultra scale HFCBGA package size: 70mm x 70mm
- Accelerate SI/PI/Thermal co-simulation with the state-of-the-art simulation workflow
- Achieve first-pass signal and power integrity for 112G PAM4 LR, 200+ lanes in the same die and package
- Power consumption up to 700W
GUC 核心優勢
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service