日期
標題
111/06/08
GUC Announces to Join UCIe as Contributor Member
111/06/07
GUC Will Be Exhibiting at TSMC 2022 Technology Symposium
111/05/26
GUC Proprietary Interposer Design to Achieve 8.4Gbps, Enable HBM3 for Hyperscale HPC / AI / Networking SoCs
111/05/20
GUC GLink 2.5D and 3D Presentation to OCP/ODSA Committee
111/05/18
GUC HBM3 Platform is Silicon Proven at TSMC N7 and CoWoS Technology
111/04/27
GUC Joins Universal Chiplet Interconnect Express (UCIe) as Contributor Member
111/04/21
GUC to Present at ChipEx 2022
111/03/22
GUC has successfully taped out N5 HBM3 8.4G test chip
111/02/21
GUC completed TSMC N5 V1.2 enhancement, offering new design flow to close S2S gap and yield improvement
111/01/17
GUC built up TSMC N3 design flow and completed silicon correlation in 2021, migrating to N3E technology in 2022
111/01/17
GUC Validates TSMC CoWoS-R® Design Solution using N5 4Gbps HBM2E