GUC Compact Package Solution for High End Consumer Product
GUC developed and released production in 3Q20 the first MCeP (Molded Core embedded Package) package-on-package (PoP) with CCB (Copper Core Ball) solution to enable the compact package size for high-end digital camera application by TSMC N12 technology.
MCeP is the alternative of PoP with good package warpage control, smaller package size and passive components embedded.
GUC 核心優勢
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service