GUC offers TSMC N3E v1.1 and N3P v0.9 Technology
- GUC builds up TSMC 3nm design flow, offer N3E v1.1 and N3P v0.9 technology for all of HPC, AI and Networking
- Update the existing N3E design flow from v1.0 to v1.1
- Offer the N3P v0.9 design flow, boost over 15% performance, reduce 15~30% power (vs. N5), v1.0 will be available by 1Q24
- Design Challenge
- TSMC FINFLEX: innovated hybrid row cell
- Power grid and the Reff optimization for IR mitigation
- Preparation of APT total solution (HBM, GLink, UCIe) at N3E & N3P
GUC 核心優勢
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service