GUC ARM Platform Solution Enables Customer's Product Success

Service

  • Define spec and architecture with customer by function and performance requirement

  • Plan and optimize ARM interconnect by spec

  • Design and integrate ARM interconnect by using GUC in-house design automation tool

  • Design verification and prototyping by emulator/FPGA

  • Power analysis flow

  • Hardening with excellent PPA

  • Customized logic and block by request

  • Software development

 

SoC Platform and ARM Core Architecture

  • ARM N2/N1 3D platform with GUC HBM3, GLink 2.2 and GLink-3D

  • ARM CA75/73/72/57/55/53 multiple clusters

  • Interface IP: PCIe 4, USB3.1, SATA3, Ethernet, (LP)DDR4

  • System clock/reset control

  • TSMC N3/N5/N6/N7/N12/N28 process nodes

  • Support TSMC 3DFabric technology

 

In-house Design Automation Tool

  • Quality: automatically generate RTL, testbench, and document from spec (100% correctness)

  • Time to market: speed up design implementation, iteration, and verification by the automation flow

GUC 核心優勢

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service