GUC ARM Platform Solution Enables Customer's Product Success
Service
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Define spec and architecture with customer by function and performance requirement
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Plan and optimize ARM interconnect by spec
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Design and integrate ARM interconnect by using GUC in-house design automation tool
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Design verification and prototyping by emulator/FPGA
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Power analysis flow
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Hardening with excellent PPA
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Customized logic and block by request
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Software development
SoC Platform and ARM Core Architecture
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ARM N2/N1 3D platform with GUC HBM3, GLink 2.2 and GLink-3D
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ARM CA75/73/72/57/55/53 multiple clusters
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Interface IP: PCIe 4, USB3.1, SATA3, Ethernet, (LP)DDR4
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System clock/reset control
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TSMC N3/N5/N6/N7/N12/N28 process nodes
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Support TSMC 3DFabric technology
In-house Design Automation Tool
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Quality: automatically generate RTL, testbench, and document from spec (100% correctness)
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Time to market: speed up design implementation, iteration, and verification by the automation flow
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service