GUC Industry-leading 5Tbps/mm Die-to-Die GLink 2.3LL IP Showing Good Silicon Results
- GLink (GUC multi-die interLink) is the most optimized solution on power, area and speed for multi-die integration by InFO or CoWoS. GLink 1.0 and GLink 2.0 are silicon proven
- GLink 2.3LL is backward compatible with GLink 1.0 and 2.0, with double bandwidth per beachfront under similar power efficiency, and Low Latency up to 5ns
- All silicon measurement results exceed spec
- Total Service Package:
- Sub-system built/integration
- InFO_RDL / Interposer design for InFO / CoWoS Advanced Packaging
- SI/PI/Thermal co-sim
- Sub-system bring-up services
- Reliable Solution:
- Robust transmission, with Replay buffer for error correction
- DFT functionality for separate dies testing and InFO/CoWoS assembly testing
- Redundant lanes for lane repair to achieve the best yield
- Power consumption is proportional to actual transferred traffic, almost zero at no traffic
Learn more about GLink, please click HERE
GUC 核心優勢
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service