GUC offers TSMC N4P V1.0 Technology
- GUC has successfully taped out N5 HPC product using GUC GLink-2.5D for die-to-die interconnect and packaged in tsmc InFO_oS 2.5D advanced package for ASIC client
- GUC GLink/InFO/CoWoS Total Solution
- Lowest Power : 0.3 pJ/bit ; Lowest Latency : 5ns end-to-end
- Highest Beachfront efficiency (full-duplex) up to 2.5 Tbps/mm
- DFT for separate dies testing and InFO_oS/CoWoS assembly testing
- Redundant lanes embedded to achieve better yield
- Performance monitoring agent (proteanTecs) for GLink signal quality monitor and repair
- GLink add-on IP (AXI/CXS Bus Bridges, …) enable seamless system integration
- Best CoWoS and InFO production management
GUC 核心優勢
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service