GUC Offers Comprehensive 2.5D Package Design Service to Enable Customer's Product Success for Hyperscale Datacenter Applications
GUC offers a wide range of package solutions from traditional wire bond, high-end flip chip, to advanced 2.5D IC package
With GUC in-house package design capability, such as substrate layout design, electrical simulation, thermal simulation, etc., GUC's advanced package design service provides the all-in-one solution to achieve high performance, effective cost, and manufacturing management in one shot, ensuring fast time to market and time to volume.
GUC is your trusted package solution provider that has successfully helped numerous customers launch competitive products in the market.
Key Success Stories :
- 70x70 FCBGA for Networking
- 60x60 CoWoS for DC AI Training
- 50x50 FCBGA for DC AI Inference
- 16x16 MCeP for High-end Consumer Products
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service