GUC Provides InFO_oS Packaging Service for AI/HPC/Networking Applications
TSMC InFO_oS is an innovative wafer level system integration technology platform, featuring high density 2/2µm RDL (Re-Distribution Layer) line width/space to integrate multiple advanced logic chiplets for various HPC applications. It enables hybrid pad pitches on SoC with minimum 40µm I/O pitch, minimum 130µm C4 Cu bump pitch and > 2X reticle size InFO on >65 x 65mm substrates.
.png)
InFO_oS Production Flow
GUC offers total service package including GLink-2.5D (D2D) IP, SoC design, InFO_RDL/Package design, system level SI/PI co-simulation, bring up tests, product qualification and ramping.
.png)
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service