GUC Taped out Industry-leading 5Tbps / mm, 5nm Die-to-Die GLink 2.3 IP
GLink (GUC multi-die interLink) is the most optimized solution on power, area and speed for multi-die integration by InFO or CoWoS. GLink 1.0 and GLink 2.0 are silicon proven.
Continuing the momentum, we have successfully taped out N5 GLink 2.3 in Oct’21 and expected to have silicon report in 3Q22. GLink 2.3 is backward compatible with GLink 1.0 and 2.0, with almost double bandwidth per beachfront under similar power efficiency.
Total Service Package
- Sub-system built/integration
- InFO_RDL / Interposer design for InFO / CoWoS Advanced Packaging
- SI/PI/Thermal co-sim
- Sub-system bring-up services
Reliable Solution:
- Robust transmission, with Replay buffer for error correction
- DFT functionality for separate dies testing and InFO/CoWoS assembly testing
- Redundant lanes for lane repair to achieve the best yield
Power consumption is proportional to actual transferred traffic, almost zero at no traffic.
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service