GUC has successfully taped out N3E HBM3 8.6G and Die-to-Die GLink 2.3LL 17.2G IP in January
- N3E HBM3 8.6G and Die-to-Die GLink 2.3LL 17.2G IP are both expected to be silicon validated in 4Q23
- Target application : AI/HPC/Networking
- GUC HBM/CoWoS Total Solution
- In-house HBM2E/HBM3 Controller and PHY IP
- Proprietary interposer layout pattern to achieve best SI/PI
- Support Y direction offset by zig-zag or 45o
- Embedded all-pin, in-mission mode performance and health monitoring by proteanTecs
- Best CoWoS production management
- GUC GLink/InFO/CoWoS Total Solution
- Lowest Power : 0.3 pJ/bit ; Lowest Latency : 5ns end-to-end
- Highest Beachfront efficiency (full-duplex) up to 2.5 Tbps/mm
- Raw BER < 1E-20, after CRC/Retry << 1FIT
- DFT for separate dies testing and InFO_oS/CoWoS assembly testing
- Redundant lanes embedded to achieve better yield
- Performance monitoring agent (proteanTecs) for GLink signal quality monitor and repair
- GLink add-on IP (AXI/CXS Bus Bridges, …) enable seamless system integration
- Best CoWoS and InFO production management
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service