GUC Tapeouted 3DIC Testchip by WoW Technology
- Beyond Moore’s law era, Chiplet is the economical method to build large systems out of smaller functions. There are several advanced packaging technologies for chiplets integration, such as CoWoS, InFO_oS, SoIC, …, etc. After the experience of DTC stacked-on-logic die by WoW technology, GUC successfully taped out another 3DIC logic-on-logic test chip by WoW technology again.
- The Benefits of 3DIC
- Reduce RC loading, power consumption and latency
- Increase bandwidth
- Heterogeneous die integration for PPA optimization
For more information, please contact your GUC sales representative directly or email guc_sales@guc-asic.com
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service