GUC built up TSMC N3 design flow and completed silicon correlation in 2021, migrating to N3E technology in 2022
Highlights:
- Silicon proven 4Gbps HBM2E on TSMC CoWoS-R ® (Organic Interposer) technology
- GUC provides fully verified CoWoS-R design service
- With extensive CoWoS-S production experience and new CoWoS-R technology, GUC can provide optimal performance-cost solution to customer's SoC
- HBM3 on both CoWoS-S and CoWoS-R will be silicon validated in Q2'22
GUC 核心優勢
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service