GUC built up TSMC N3 design flow and completed silicon correlation in 2021, migrating to N3E technology in 2022


  • Silicon proven 4Gbps HBM2E on TSMC CoWoS-R ® (Organic Interposer) technology
  • GUC provides fully verified CoWoS-R design service
  • With extensive CoWoS-S production experience and new CoWoS-R technology, GUC can provide optimal performance-cost solution to customer's SoC
  • HBM3 on both CoWoS-S and CoWoS-R will be silicon validated in Q2'22

GUC Core Strengths

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service