GUC 3nm Design Platform
GUC is offering complete 3nm Design Platform for HPC, AI and Networking, assisting 1st N3E Customer tape-out in September 2022.
- GUC worked with EDA vendors to build up 3nm automation design flow from RTL to GDSII
- GUC in house test chip tape-out and silicon verification in 2021
- 1st GUC HBM3 and GLink IP design win in 2022
- The most leading 3nm APT solution will be available in 2023
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service