GUC HBM3 & D2D (Die-to-Die) / 2.5D Total Service Package
GUC HBM3 & D2D (Die-to-Die) / 2.5D Total Service Package
- Complete Service Scope, including IP and CoWoS/InFO design
- HBM3 up to 8.6G : N7, N5 and N3P ready
- GLink 2.3LL (5Tbps/mm) : N5 and N3P ready
- GUCIe 1.0 (UCIe 32G compliant) : N3P TPO in Nov'23
Link Path: https://www.guc-asic.com/upload/media/GUC_GLink_HBM_one_page2023.pdf
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service