GUC HBM3 & D2D (Die-to-Die) / 2.5D Total Service Package

GUC HBM3 & D2D (Die-to-Die) / 2.5D Total Service Package

  • Complete Service Scope, including IP and CoWoS/InFO design
  • HBM3 up to 8.6G : N7, N5 and N3P ready
  • GLink 2.3LL (5Tbps/mm) : N5 and N3P ready
  • GUCIe 1.0 (UCIe 32G compliant) : N3P TPO in Nov'23

Link Path: https://www.guc-asic.com/upload/media/GUC_GLink_HBM_one_page2023.pdf

 

GUC Core Strengths

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service