GUC Completed TSMC N5 V1.2 Enhancement, Offering New Design Flow to Close S2S Gap and Yield Improvement

GUC completed TSMC N5 V1.2 enhancement, offering new design flow to close S2S gap and yield improvement

  • Completed GUC standard cells and TCAM re-characterization
  • Completed V1.2 compliance for GLink-2.5D and HBM2(E)/3 IP
  • Provide PDK impact analysis and help customer migrate from v1.1 to V1.2
  • Enhance re-characterization solution for N5 V1.2

GUC Core Strengths

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service