GUC has successfully taped out N5 HBM3 8.4G test chip

  • GUC has successfully taped out N5 HBM3 8.4G test chip and expected to be silicon validated in 4Q22

  • GUC HBM Record and Roadmap

    • N5/N7 HBM3 IP available
    • N3 HBM3 IP to be available in 2H22
    • Support both CoWoS-S and CoWoS-R
    • Multiple HBM2/2E customer AI/HPC products under mass production
    • Multiple HBM3 customer AI/HPC/Networking products are in design stage

 

  • GUC HBM/CoWoS Total Solution

    • In-house HBM2E/HBM3 Controller and PHY IP

    • Proprietary interposer layout pattern to achieve best SI/PI

    • Support Y direction offset by zig-zag or 45o

    • Embedded all-pin, in-mission mode performance and health monitoring by proteanTecs

    • Best CoWoS production management

GUC Core Strengths

  • Advanced Packaging Technology Leadership
  • Design Engineering Excellence
  • Customer Trusted Service