Silicon Proven CoWoS-R (RDL Interposer) Solution
In-house CoWoS-R® design flow is ready and silicon proven
- GUC CoWoS-R design is silicon proven
- Validated HBM3, GLink-2.5D, and 112G SerDes IPs
- Highly correlated cosim and silicon result
- IPD (Integrated Passive Device) serves as decoupling capacitor, which is critical to high-speed and high-power operation
CoWoS-R Highlights
- Lower interconnect RC and no TSV requirement to support high speed transmission
- 3.3x reticle interposer size solution ready, 4x reticle size on roadmap
GUC provides all TSMC CoWoS family design service
- CoWoS-S is under high volume production
- CoWoS-R is silicon proven, ready for customer adoption
- CoWoS-L is under design validation
CoWoS-R with IPD
GUC Core Strengths
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service